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Posted May 18, 2017 10:29 (GMT +7)

Toshiba's SO6L Package IC Photocouplers Now Have Option for Wide Leadform

 New products realize direct replacement from current SDIP6(F type) package products.

TOKYO--(BUSINESS WIRE)--May. 17, 2017

Toshiba Corporation's (TOKYO:6502) Storage & Electronic Devices Solutions Company is expanding its line-up of SO6L IC photocouplers with a new package type SO6L(LF4), the wide leadform option. The wide leadform option is available for three high-speed IC photocouplers and five IGBT/MOSFET driver photocouplers. Mass production shipments start today.

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Toshiba: New package type SO6L(LF4), the wide leadform option, realizes direct replacement from curr ...

Toshiba: New package type SO6L(LF4), the wide leadform option, realizes direct replacement from current SDIP6(F type) package products. (Photo: Business Wire)

The new photocouplers are in a SO6L(LF4) package and can be mounted on land patterns of SDIP6(F type) products with a maximum height of 4.15mm. The SO6L(LF4)’s 2.3mm (max) thin package offers users the advantage of directly replacing SDIP6(F type) products in height-critical applications that require lower package height, such as a back of PCBs.

To support replacement of widely used original land pattern of SDIP6(F type) package products, Toshiba will expand the wide leadform option line-up for other SO6L IC photocouplers.

The latest Gartner market report recognizes Toshiba as the leading manufacturer of optocouplers by sales in 2015 and 2016, with 23% of sale-based market share in CY2016. (Source: Gartner “Market Share: Semiconductor Devices and Applications Worldwide 2016” 30 March, 2016)

Toshiba will continue to deliver products that meet the needs of customers by promoting the development of a diverse portfolio of photocouplers and photorelays tailored to market trends.


High-speed communication photocoupler
• Factory networking
• High-speed digital interfacing for instrumentation and control devices
• I/O interface boards
• Programmable logic controllers (PLCs)
• Intelligent power module (IPM) drive *
IGBT/MOSFET driver photocoupler
• Industrial inverters
• Air conditioner inverters
• Inverters for solar energy


Package height: 2.3mm (max)
1.85mm lower than SDIP6(F type) (reduced 45 %)
Pin distance: 9.35mm (min)
Direct replacement is possible since SDIP6(F type) pin distance is 9.4mm (min)

Main Specifications
































TLP2704(LF4) SO6L-LF4 8 5 1.3 5 550 - ±20
TLP2761(LF4) 1 1.6 80 - ±20
TLP2768A(LF4) 4 5 60 - ±20
TLP5701(LF4) 2 5 500 0.6 ±20
TLP5702(LF4) 3 5 200 2.5 ±20
TLP5751(LF4) 3 4 150 1 ±35
TLP5752(LF4) 2.5
TLP5754(LF4) 4

Follow the link below for more on the new products and Toshiba’s photocoupler line-up.

Customer Inquiries:
Optoelectronic Device Sales & Marketing Dept.
Tel: +81-3-3457-3431

Information in this document, including product prices and specifications, content of services and contact information, is correct on the date of the announcement but is subject to change without prior notice.

About Toshiba

Toshiba Corporation, a Fortune Global 500 company, channels world-class capabilities in advanced electronic and electrical product and systems into three focus business fields: Energy that sustains everyday life, that is cleaner and safer; Infrastructure that sustains quality of life; and Storage that sustains the advanced information society. Guided by the principles of The Basic Commitment of the Toshiba Group, “Committed to People, Committed to the Future”, Toshiba promotes global operations and is contributing to the realization of a world where generations to come can live better lives.

Founded in Tokyo in 1875, today’s Toshiba is at the heart of a global network of 550 consolidated companies employing 188,000 people worldwide, with annual sales surpassing 5.6 trillion yen (US$50 billion). (As of March 31, 2016.)

To find out more about Toshiba, visit

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Media Inquiries:
Toshiba Corporation
Storage & Electronic Devices Solutions Company
Digital Marketing Department
Chiaki Nagasawa, +81-3-3457-4963

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